Could I help you?

IPC 7091A

IPC 7091A Design and Assembly Process Implementation of 3D Components

standard by Association Connecting Electronics Industries, 01/01/2023

More details

Reduced price!
M00009378
New product
Limited time offer:

$81.45

$181.00

-55%

In stock

- +

Add to compare

 
More info

Full Description

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

 
Custom tab

This is a custom block edited from admin panel.You can insert any content here.

30 other products in the same category:

Compare 0

No products

To be determined Shipping
$0.00 Total

Check out