Cart
0
0
item(s)
-
$0.00
No products
To be determined
Shipping
$0.00
Total
Quantity
Total
Product successfully added to your shopping cart
There are 0 items in your cart.
There are 0 items in your cart.
Total
IPC 4555
IPC 4555 Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022
Reduced price!
M00001641
New product
Full Description
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
