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IPC J-STD-005

IPC J-STD-005

IPC J-STD-005 Requirements for Soldering Pastes, Includes Amendment 1 (2007)

standard by Association Connecting Electronics Industries, 01/01/1995

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Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.

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Published: 01/01/1995 ANSI: ANSI Approved Number of Pages: 38 Part of: IPC A-20/21-GKIT

 
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