Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.
Product Details
Published: 07/10/1995 Number of Pages: 12 File Size: 1 file , 180 KB Part of: IPC 9500-K, IPC M109 Product Code(s): 9501(D)1
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