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IPC 4563

IPC 4563

IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline

standard by Association Connecting Electronics Industries, 11/01/2007

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This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

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Published: 11/01/2007 Number of Pages: 19 File Size: 1 file , 270 KB

 
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