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IPC J-STD-005A

IPC J-STD-005A

IPC J-STD-005A Requirements for Soldering Pastes

standard by Association Connecting Electronics Industries, 02/01/2012

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This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

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Published: 02/01/2012 ANSI: ANSI Approved Number of Pages: 24 File Size: 1 file , 1.1 MB

 
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