IPC-7801 provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology to demonstrate acceptable oven performance repeatability. Equipment calibration and maintenance guidelines are provided. This standard is intended to verify the operating parameters of the reflow oven. This standard is not intended for the assembly product profile/recipe. This standard does not provide guidance for vapor phase processes.
Product Details
Published: 03/01/2015 Number of Pages: 28 File Size: 1 file , 1.6 MB
Custom tab
This is a custom block edited from admin panel.You can insert any content here.