IEC 62137-1-2 Ed. 1.0 b:2008

IEC 62137-1-2 Ed. 1.0 b:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

standard by International Electrotechnical Commission, 05/14/2008

More details

Reduced price!

M00018281

New product

Limited time offer:

$39.15

$87.00

-55%

In stock

- +

Add to compare

More info
Custom tab

More info

Full Description

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.