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IEC 60749-35 Ed. 1.0 b:2006

IEC 60749-35 Ed. 1.0 b:2006

IEC 60749-35 Ed. 1.0 b:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

standard by International Electrotechnical Commission, 07/18/2006

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Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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Edition: 1.0 Published: 07/18/2006 Number of Pages: 43 File Size: 1 file , 1 MB

 
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