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IEC 60749-15 Ed. 3.0 b:2020

IEC 60749-15 Ed. 3.0 b:2020

IEC 60749-15 Ed. 3.0 b:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

standard by International Electrotechnical Commission, 07/14/2020

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IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

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Edition: 3.0 Published: 07/14/2020 Number of Pages: 17 File Size: 1 file , 1000 KB

 
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