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BS PD IEC TR 61760-3-1:2022

BS PD IEC TR 61760-3-1:2022

BS PD IEC TR 61760-3-1:2022 Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

standard by BSI Group, 10/31/2022

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All current amendments available at time of purchase are included with the purchase of this document.

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Published: 10/31/2022 ISBN(s): 9780539179361 Number of Pages: 30 File Size: 1 file , 2.4 MB Product Code(s): 30438361, 30438361, 30438361 Note: This product is unavailable in Ukraine, Russia, Belarus

 
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