IPC 4101
Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997
IPC FC-234
Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Printed Circuits
standard by Association Connecting Electronics Industries, 12/10/1997
IPC QL-653A
Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials
standard by Association Connecting Electronics Industries, 11/01/1997
IPC TR-476A
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
standard by Association Connecting Electronics Industries, 01/01/1997
IPC TR-467
Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)
standard by Association Connecting Electronics Industries, 11/01/1996
IPC J-STD-013
Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996