IPC 4130
Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998
IPC 4110
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/1998
IPC 9504
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
standard by Association Connecting Electronics Industries, 06/01/1998
IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
IPC 7711/7721
Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998
IPC 6015
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
standard by Association Connecting Electronics Industries, 02/01/1998
IPC TP-1114
The Layman's Guide to Qualifying a Process to J-STD-001
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1998