IPC J-STD-028
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999
IPC 4411
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement
standard by Association Connecting Electronics Industries, 04/01/1999
IPC FLEX-CO-99
IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC CH-65A
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
IPC BET-99
National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC TP-1115
Selection and Implementation Strategy for a Low-Residue, No-Clean Process
standard by Association Connecting Electronics Industries, 12/01/1998