IPC 9202
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
standard by Association Connecting Electronics Industries, 10/01/2011
IPC 9707
Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011
IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
IPC 7093
Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011
IPC SM-840E
Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 1071
Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 9631
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 7351B
Generic Requirements for Surface Mount Design and Land Pattern Standard
standard by Association Connecting Electronics Industries, 06/01/2010