IPC 4101E
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2015
IPC 4101D-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015
IPC T-50M
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 05/01/2015
IPC 9702-WAM1
Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015
IPC J-STD-020E
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 01/01/2015